ASMPT SEMI Solutions

About ASMPT SEMI Solutions

Intelligent chips are transforming our world – ASMPT Semiconductor Solutions provides the technology for what comes next. ASMPT Semiconductor Solutions (ASMPT SEMI) is a world-leading provider of forward-looking solutions for advanced packaging and semiconductor assembly. By integrating chips, systems, and technologies, We form the backbone of future intelligent applications in Artificial Intelligence, Smart Mobility, and Hyperconnectivity. This is how we Empower the Intelligence Revolution. What We Do Our comprehensive portfolio spans the full semiconductor packaging process chain — from deposition and laser dicing to mainstream interconnect technologies and next generation advanced packaging, including wafer level packaging, thermocompression bonding, and hybrid bonding. Designed for demanding applications, our solutions deliver higher performance, reliability, and more cost-efficiency across key industries. Who We Work With We partner with the world's leading IDMs, OSATs, foundries, and electronics manufacturers to help them overcome production complexity, accelerate innovation, and scale reliably from development to high volume manufacturing. What Makes Us Different Our strength lies in close, long term collaboration with customers, underpinned by deep packaging expertise and global manufacturing scale. Through established partnerships with leading industry players, our globally distributed R&D teams work as an extension of our customers’ organizations — combining world class expertise with strong local presence to support performance, productivity, and architectural evolution across generations of semiconductor devices. Our Global Presence Part of ASMPT Ltd, we operate across Asia, Europe, and the Americas, backed by 15+ manufacturing and R&D centres and a team of more than 9,000 specialists worldwide. Follow this Page for insights on advanced packaging, semiconductor assembly, and the technology Empowering the Intelligence Revolution.