NAMICS Corporation

About NAMICS Corporation

NAMICS is a global technology leader in advanced underfills, encapsulants, adhesives, and insulating and conductive materials that enable the performance, reliability, and miniaturization of next-generation electronic systems. With 80 years of experience, NAMICS supports leading manufacturers of semiconductor devices, passive components, solar cells, and advanced optoelectronic assemblies. Headquartered in Niigata, Japan, NAMICS operates a global network of subsidiaries and technical centers across the United States, Europe, Korea, Taiwan, Hong Kong, Singapore, and China, allowing us to provide localized engineering support and rapid collaboration with customers worldwide. As electronic systems evolve toward AI-driven architectures, high-density packaging, and multi-functional integration, NAMICS delivers materials engineered for AI structure integration, including advanced chip packaging, system-in-package (SiP), heterogeneous integration, and high-performance computing modules. Our materials are designed to meet the demanding thermal, mechanical, and electrical requirements of AI processors, edge devices, and data-centric platforms. In parallel, NAMICS is a trusted materials partner for camera modules and imaging systems, supplying precision adhesives and encapsulants that support lens assembly, image sensor protection, optical alignment stability, and long-term reliability in automotive, mobile, industrial, and AI-enabled vision applications. We do more than manufacture materials—we build long-term partnerships. NAMICS sets the gold standard in customer engagement by offering highly customized material solutions, deep application expertise, and world-class technical support. By working closely with our customers from design through production, we deliver optimized, application-specific solutions that drive performance, reliability, and time-to-market success.