ASE Global participated in the 3DIC Global Summit addressing the challenge of scaling advanced packaging technologies for high-volume manufacturing.

ASE (Advanced Semiconductor Engineering, Inc), a member of ASE Technology Holdings (NYSE:ASX) is one of the world's largest providers of outsourced semiconductor manufacturing services in assembly and test (OSAT), and, a leading provider of electronic manufacturing services (EMS) through its sister company, USI.  Addressing global proliferation of sophisticated electronics geared towards improving lifestyle and efficiency, ASE is strategically integrating synergies between its well established OSAT and EMS business units. ASE is at the forefront of a new class of EMS that delivers modularized, miniaturized ICs with system-level precision to enable high-performance and highly integrated devices. As a result, ASE is truly bridging the gap between silicon and system makers. From traditional semiconductor players to players innovating applications within IoT, wearables, automotive, AR/VR, connectivity and many more, success within an increasingly dynamic market hinges on creating and sustaining highly productive manufacturing partnerships. ASE has proven ability to collaborate closely with customers, to understand markets and create value propositions, and to deliver advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. Manufacturing facilities are strategically located within key electronics manufacturing hubs, including Taiwan, China, Korea, Japan, Malaysia, and Singapore. Serving customers across the global electronics ecosystem, regional sales offices are located in Sunnyvale (USA), Brussels (Europe), Hsinchu (Taiwan), Shanghai/Beijing (China), Shenzhen (China), Yokohama (Japan), Gyeonggi-do (Korea) and Singapore. For more, please visit: aseglobal.com. Also, please follow ASE on Twitter: @aseglobal.