Finetech will have Aliaksandr Yermak at the IEEE Electronics System-Integration Technology Conference 2026, booth 24, to discuss high-accuracy die bonding technology across the quantum stack.

Headquartered in Berlin, Germany, Finetech is a global supplier of high-precision die bonding and micro-assembly equipment, supporting semiconductor, photonics, and advanced packaging applications for more than 30 years. We enable customers from early feasibility and process development through scalable, automated production. Our platforms share a consistent technology foundation, allowing seamless transfer from prototype to high-yield manufacturing without changing system logic or process philosophy. Finetech systems integrate a broad range of bonding technologies, including adhesive, eutectic, thermocompression, ultrasonic, indium bump interconnect, hybrid bonding, and direct bonding. This flexibility supports heterogeneous integration and complex microsystem assembly across applications such as optical transceivers, LiDAR modules, power devices, MEMS, RF components, quantum hardware, and high-density packages. Our cross-platform Prototype-to-Production approach helps customers establish robust processes early and transition them efficiently into controlled production environments with predictable performance and long-term stability. In addition, Finetech provides dedicated SMD rework solutions for electronics manufacturing and failure analysis. With subsidiaries on three continents and a global partner network, we deliver local expertise, fast support, and long-term technical collaboration worldwide.