Foxconn Interconnect Technology (FIT) showcased its next-generation XPO interconnect technology at Arista Innovation Day on September 2, 2026, highlighting the collaboration and technical engagement between FIT and industry leaders.

FIT is an innovative market leader of connectivity technologies within the data center, mobile, computing, and IoT environments. Foxconn Interconnect Technology, Ltd. (FIT) has offices and manufacturing sites located in Asia, the Americas, and Europe. FIT develops, manufactures, and markets electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. FIT had a very successful IPO on July 13, 2017 and is traded on the Hong Kong Stock Exchange as FIT Hon Teng (stock 6088). Prior to that, FIT was a wholly owned subsidiary of Foxconn. FIT was the original product line of Foxconn, founded as Hon Hai Precision Industry Co. by Terry Gou in 1974 which has grown into one of the largest companies in the world. FIT offers competitive compensation and world class benefits. In addition, we recognize the performance of the company, business unit and individual through our incentive and recognition programs. FIT is an Equal Opportunity Employer committed to inclusion and diversity: Females / Minorities / Veterans / Disabled Website: http://www.fit-foxconn.com