Global Electronics Association Leader Peter Tranitz breaks down why the package-PCB interface is at the center of performance, power delivery, and reliability decisions in AI and HPC systems.

The Global Electronics Association, formerly known as IPC, is the leading voice of the $6 trillion global electronics industry. Since 1957, we’ve supported the growth and success of more than 3,000 member companies across the electronics supply chain, from design and printed boards to advanced packaging, assembly, and testing. As a member-driven organization, we deliver internationally recognized standards, trusted certification programs, workforce education, market intelligence, and public policy advocacy to strengthen and advance the global electronics ecosystem. Our mission is to enable better electronics for a better world through smarter collaboration, resilient supply chains, and shared innovation. With global headquarters in Bannockburn, Illinois, the Global Electronics Association has operations in Belgium, China, Germany, India, Japan, Korea, Malaysia, Mexico, Taiwan, and the United States and a presence across dozens more countries to support its members. Follow our blog to stay up to date on the latest Association happenings: https://www.electronics.org/blog