KoolMicro, Inc. showcased its Chip Level Liquid Cooling technology at the Topco Scientific booth at SEMICON Taiwan 2026 in the TSC Booth I2700, TaiNEX.

As high-density GPU clusters and next-generation packaging push power boundaries, incremental cooling gains are no longer viable. KoolMicro designs and manufactures advanced liquid cooling systems engineered to eliminate thermal bottlenecks where computing scales. Built on deep expertise in semiconductor architecture, we bridge the structural gap between rapid AI infrastructure demands and lagging thermal technologies. Our patented Integrated Manifold MicroChannel (IMMC) technology delivers thermal management efficiency more than 58% higher than comparable market alternatives. From consecutive tech generations (IMMC-1, 2, 3) to scalable system-level integration, our roadmap is engineered to meet the extreme thermal workloads projected 2–3 years ahead. We solve the thermal limits of high-performance computing, enabling the next generation of semiconductors to scale without constraints. Core Focus: IMMC Liquid Cooling, High-Density GPU Clusters, Next-Gen Semiconductor Packaging