Mintres BV is attending the Dutch Photonics Event in Brabanthallen-Den Bosch on 16-17 September 2026 at Booth 4.

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Two weeks to go until DutchPhotonicsEvent! We’re getting ready to connect with the Dutch photonics community. If you’re joining, stop by Booth 4 — we’d love to show you…

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Company

Mintres BV

No matter how fast you move, you need a reliable partner for all your heat spreading needs!

Industry
Industrial Machinery Manufacturing
Location
Cuijk, NL
Company size
11–50 employees

About Mintres BV

Mintres B.V, established in March 2008, supplies the global semiconductor industry in the areas of electronics, opto-electronics, photonics (InP/GaAs photodiodes) and hi-power lasers. The ISO9001:2015 certified company employs over forty people, continues to grow (+20% in 2020) and invests in novel technologies. Mintres’ specialty is R&D, prototyping and the large-volume production of components (all in-house). The company offers a variety of custom-made products based on synthetic CVD diamond and hi-performance ceramics (aluminium nitride, aluminium oxide, silica): o Thermal management: heat-spreaders (to target “hot-spots”), heat-sinks and micro-coolers. o Optics: laser optical-windows, detectors, sensors, beam-positioning, ATR prisms. o Other CVD diamond products: temperature sensors, electro-chemical sensors, and detectors. Mintres has long experience in the processing of diamond and ceramics, and offers the following services and processing capabilities: o Sputter Metallisation: - Sputter coating (wafers and individual components): Ti, Pt, Au, AuSn, AuGe, Sn, Cu, TiN, Ta, Ni, CuAg, Al, Ag, Cr, and TaN. o Plasma treatment and etching: - Ion Beam Milling, Reactive-ion Etching, Oxygen-plasma cleaning. o QC/QA testing and inspection: - Shearing; wetting; pad-to-pad; adhesion; resistance; thickness etc. - SEM & EDX, automated dimensional metrology, 3D confocal microscopy, optical microscopes, surface profilometer. o Assembly capabilities: - Automated die sorting and manual high precision die bonding. - Large selection of soldering, brazing, and bonding techniques. - Thermal compression bonding. o Laser processing: - YAG laser cutting of diamond and semiconductors, YAG trimmer, UV laser engraving and marking, UV Excimer lasers for high precision ablation. o Dicing of ceramic wafers. o Photolithography for complex precision pattern making. o Mechanical polishing and lapping of diamond. o Large Cleanroom Class 100, chemistry lab and WCR.

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