Mintres BV is attending the Dutch Photonics Event in Brabanthallen-Den Bosch on 16-17 September 2026 at Booth 4.
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Two weeks to go until DutchPhotonicsEvent! We’re getting ready to connect with the Dutch photonics community. If you’re joining, stop by Booth 4 — we’d love to show you…
Company
Mintres BV
No matter how fast you move, you need a reliable partner for all your heat spreading needs!
- Industry
- Industrial Machinery Manufacturing
- Location
- Cuijk, NL
- Company size
- 11–50 employees
About Mintres BV
Mintres B.V, established in March 2008, supplies the global semiconductor industry in the areas of electronics, opto-electronics, photonics (InP/GaAs photodiodes) and hi-power lasers. The ISO9001:2015 certified company employs over forty people, continues to grow (+20% in 2020) and invests in novel technologies. Mintres’ specialty is R&D, prototyping and the large-volume production of components (all in-house). The company offers a variety of custom-made products based on synthetic CVD diamond and hi-performance ceramics (aluminium nitride, aluminium oxide, silica): o Thermal management: heat-spreaders (to target “hot-spots”), heat-sinks and micro-coolers. o Optics: laser optical-windows, detectors, sensors, beam-positioning, ATR prisms. o Other CVD diamond products: temperature sensors, electro-chemical sensors, and detectors. Mintres has long experience in the processing of diamond and ceramics, and offers the following services and processing capabilities: o Sputter Metallisation: - Sputter coating (wafers and individual components): Ti, Pt, Au, AuSn, AuGe, Sn, Cu, TiN, Ta, Ni, CuAg, Al, Ag, Cr, and TaN. o Plasma treatment and etching: - Ion Beam Milling, Reactive-ion Etching, Oxygen-plasma cleaning. o QC/QA testing and inspection: - Shearing; wetting; pad-to-pad; adhesion; resistance; thickness etc. - SEM & EDX, automated dimensional metrology, 3D confocal microscopy, optical microscopes, surface profilometer. o Assembly capabilities: - Automated die sorting and manual high precision die bonding. - Large selection of soldering, brazing, and bonding techniques. - Thermal compression bonding. o Laser processing: - YAG laser cutting of diamond and semiconductors, YAG trimmer, UV laser engraving and marking, UV Excimer lasers for high precision ablation. o Dicing of ceramic wafers. o Photolithography for complex precision pattern making. o Mechanical polishing and lapping of diamond. o Large Cleanroom Class 100, chemistry lab and WCR.
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