Mirafra Technologies participated in the first DVCon Taiwan 2026 event in Taiwan to share engineering experience and perspectives on semiconductor design and verification challenges.

Mirafra Technologies is a leading Turnkey ASIC Solutions provider and Semiconductor Engineering Services company, helping global technology companies accelerate innovation through end-to-end engineering excellence - from Concept to Silicon to System. With a team of 2,200+ engineers and global delivery centers across India, the United States, Germany (Munich), Taiwan, and Malaysia, Mirafra combines deep domain expertise with a global delivery model to support customers worldwide. As a one-stop engineering partner, we provide end-to-end expertise across the complete semiconductor lifecycle - from architecture, design, verification, physical implementation, package and board design, embedded software, post-silicon validation, test & product engineering, and system solutions. Our engineering excellence is reflected in 650+ tape-out contributions and the trust of 50+ semiconductor customers, ranging from innovative startups to many of the world's leading semiconductor and technology companies. Beyond semiconductor engineering, Mirafra enables customers to build intelligent embedded products and accelerate digital transformation through AI, cloud, data engineering, and scalable software solutions. Driven by engineering excellence, innovation, and customer success, we help customers accelerate time-to-market, reduce engineering complexity, and deliver next-generation semiconductor and intelligent system solutions with confidence.

Founded 2004