Tessolve participated in the GTS North America conference in August 2026.

Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3800+ employees worldwide, Tessolve provides a one-stop shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy ecosystem relationship with EDA, IP, and foundries. Our front-end design strengths, integrated with the knowledge from the backend flow, allow Tessolve to catch design flaws early in the cycle, thus reducing expensive re-design costs and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial, and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across multiple market segments, 9 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, the United Kingdom, Canada, Japan, Taiwan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, and San Jose.