Company intelligence
Neu Dynamics Corporation
Capital Equipment - Machined Products - Molding Services - Consumables
About Neu Dynamics Corporation
Neu Dynamics offers a unique combination of technology and experience in the design and production of precision molds and dies for the medical, automotive, aerospace & defense, electronics and semiconductor industries. With over 30 years of experience and the latest hard milling technology from Sodick, Neu Dynamics has the resources to provide the most cost effective solutions for all of your applications. Services clients where precision machining equipment is utilized for manufacturing of encapsulation mold tooling for microchips and semiconductors. ISO 9001:2015 and ITAR certified. We also offer a complete line of specialized assembly equipment built for today's high-tech semiconductor assembly processes. Need a pilot or low-mid volume molded component production run? Neu Dynamics can fulfill your requirements. Neu Dynamics capabilities include: * Design * Prototyping * Injection Molds * Low-Mid Volume Molding and Production * High Volume Production Tooling * Hand Molds & Dies * Universal Mold Bases * Hard Tooling * Repair & Refurbishment
Verified activity
Signals from Neu Dynamics Corporation
2 published signals
Presence & Recognition
Neu Dynamics Corporation announced that HANMI Semiconductor is unveiling a line of advanced packaging equipment including 2.5D TC Bonders for AI system semiconductors and TC Bonders for High Bandwidth Memory (HBM) at SEMICON Taiwan this week.
Reported by Neu Dynamics Corporation
Presence & Recognition
Neu Dynamics Corporation is one of a dozen exhibitors at the Onshoring Conference at iMAPS Onshoring Advanced Packaging & Assembly Conference.
Reported by Neu Dynamics Corporation