Neu Dynamics Corporation announced that HANMI Semiconductor is unveiling a line of advanced packaging equipment including 2.5D TC Bonders for AI system semiconductors and TC Bonders for High Bandwidth Memory (HBM) at SEMICON Taiwan this week.

Neu Dynamics offers a unique combination of technology and experience in the design and production of precision molds and dies for the medical, automotive, aerospace & defense, electronics and semiconductor industries. With over 30 years of experience and the latest hard milling technology from Sodick, Neu Dynamics has the resources to provide the most cost effective solutions for all of your applications. Services clients where precision machining equipment is utilized for manufacturing of encapsulation mold tooling for microchips and semiconductors. ISO 9001:2015 and ITAR certified. We also offer a complete line of specialized assembly equipment built for today's high-tech semiconductor assembly processes. Need a pilot or low-mid volume molded component production run? Neu Dynamics can fulfill your requirements. Neu Dynamics capabilities include: * Design * Prototyping * Injection Molds * Low-Mid Volume Molding and Production * High Volume Production Tooling * Hand Molds & Dies * Universal Mold Bases * Hard Tooling * Repair & Refurbishment