Company intelligence
STATS ChipPAC
The world's leading integrated circuit back-end manufacturing and technology services provider
About STATS ChipPAC
STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.
Verified activity
Signals from STATS ChipPAC
3 published signals
Presence & Recognition
STATS ChipPAC attended the ISIG Conference in Suwon, Korea, where it presented on how advanced packaging is reshaping the semiconductor industry in the AI era.
Reported by Nokibul Islam
Products & Services
STATS ChipPAC is building on its advanced packaging roadmap to solve the hard problem of HBM integration, 2.5D/3D architectures, and panel-level packaging for next-generation AI silicon.
Reported by Nokibul Islam
Customers & Market
STATS ChipPAC is scaling technology, capacity, and talent to meet demand across its Singapore and South Korea sites.
Reported by STATS ChipPAC