STATS ChipPAC is building on its advanced packaging roadmap to solve the hard problem of HBM integration, 2.5D/3D architectures, and panel-level packaging for next-generation AI silicon.
Published
Signal category
Products & Services
Quote
“At STATS ChipPAC, this is the hard problem we're built to solve — alongside the customers shaping the future of compute.”
— Nokibul Islam|STATS ChipPAC team
Company
STATS ChipPAC
The world's leading integrated circuit back-end manufacturing and technology services provider
- Industry
- Semiconductor Manufacturing
- Location
- Singapore, SG
- Company size
- 2,891 employees
STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.